Surface Mount Device Package Types

Ceramic pin grid array cpga graphic cqfp.

Surface mount device package types.

Chip array small scale ball grid array cbga. The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. Ceramic flat pack clga. Micro surface mount device extended technology.

The small outline integrated circuit soic plastic package is shown above. Surface mount device package types soic package. A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame.

Concurrently as the device complexity increases the heat generated by operation. Surface mount device package types. Bump chip carrier bga. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases.

Sot 223 small outline transistor. There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below. Ceramic ball grid array cfp. A surface mount package is favored where a low profile package is required or the space available to mount the package is limited.

Bumpered quad flat pack cabga ssbga. Ceramic land grid array see lga cpga.